USB 3.0 to Bring 10x Speed Increase in 2008
During Patrick Gelsinger's keynote at the Intel Developer Forum (IDF) today, Intel made a small announcement regarding a group of companies who are now working together to create a "superspeed personal USB interconnect with 10 times the speed of the current generation technology of USB 2.0. The USB 3.0 Promoter Group -- which consists of Intel, Hewlett-Packard, NEC Corporation, NXP Semiconductors, Microsoft and Texas Instruments -- looks to make several other major changes.
Intel's USB "Cool Wall" (Source: DailyTech, Brandon Hill)
During Patrick Gelsinger's keynote at the Intel Developer Forum (IDF) today, Intel made a small announcement regarding a group of companies who are now working together to create a "superspeed personal USB interconnect with 10 times the speed of the current generation technology of USB 2.0. The USB 3.0 Promoter Group -- which consists of Intel, Hewlett-Packard, NEC Corporation, NXP Semiconductors, Microsoft and Texas Instruments -- looks to make several other major changes.
Intel's USB "Cool Wall" (Source: DailyTech, Brandon Hill)
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